July 24, 2021

Intel, MediaTek and other companies jointly develop market cooperation on a new generation of 5G fully connected PCs

Intel sold 5G baseband chips to Apple two years ago, and then reached a cooperation with MediaTek to promote 5G on the PC. Today on Telecom Day, Intel, MediaTek, Mobile and HP officially announced that they will join forces to build a new generation of 5G PC. China Mobile, Intel, Hewlett-Packard and MediaTek’s “four-party partners” believe that 5G fully connected PCs will play an unprecedentedly important role in new application scenarios such as online education and remote office, and will also be of great significance to the development of society and various industries.

 

China Mobile will join hands with Intel, HP and MediaTek to carry out market cooperation on a new generation of 5G fully connected PCs to provide end users with 5G data packets and high-quality mobile communication services.

 

However, the four companies did not mention when the 5G PC they cooperated with will come out, and the details of the first product are not available. Not surprisingly, it will be the first high-end 5G notebook.

 

At the end of November 2019, Intel and MediaTek jointly announced that the two parties will work closely in the 5G field to jointly develop, verify and support 5G baseband solutions to create the next-generation 5G PC experience.

 

As part of the cooperation, Intel will introduce the 5G baseband developed and delivered by MediaTek in consumer and commercial notebooks, based on the previously released 5G baseband Helio M70, which is part of MediaTek’s first batch of 5G SoC processors.

 

In addition, Intel will also conduct cross-platform optimization and verification, and provide OEM partners with system integration and joint design support, including drivers.

The first batch of Intel 5G notebook products using MediaTek baseband are scheduled to be launched in early 2021, and Dell and HP are expected to make their debut.

 

In addition, Intel and MediaTek are also cooperating with Fibocom to develop 5G M.2 modules, which have been optimized to integrate with Intel client platforms.

 

As the first module supplier of this solution, Fibocom will provide operator certification and regulatory support, and will lead the manufacturing, sales and distribution of 5G M.2 modules.